Product Information: Alloy composition of the dough solder is Sn42%/Bi58%, and the melting point is 138°C. Note: The melting point of the sugar paste is The welding temperature, that is, the temperature reached during welding is not the temperature set by the hot air gun during welding; The setting temperature depends on the actual welding environment. Quantity sufficient: You will receive 4 sets of clay solder, and the net content of each paste The weld is 20g/ 0.7oz, a total of 80g/ 2.8oz; The mesh size is 20 microns 38 microns, and the tin particle size can meet your electronic repair needs. Boost design: You will receive 4 sets of clay solder, each set contains 1 solder paste solder and 1 baking paste solder is easier to release; The quantity The welding speed can be flexibly controlled, so there will be no waste during welding. Equipped with 2 different sized needles, the dough is easy to work with. Soldering is suitable for various usage scenarios Wide Application: Our solder